• Rigid; rigid-flex
• 0201 chips; 0.4mm pitch μBGA/CSP
• QFP/TSOP 0.4mm pitch
• Potting & conformal coating
• 850mm x 500mm board size
• max 30 Layers board
• Press fit
• Through-hole assembly
• POP
• Full range of PCBA tests:
• AOI
• ICT, MDA
• Functional test
• Environmental, Hi-Pot
• Repair BGA Station